View BD90610EFJ-C_7771546.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product ha s no designed protection against radioactive rays 1/ 29 tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com c v tsz22111 ? 14 ? 001 07.apr.2014 rev.002 input voltage 3.5 v to 36 v output sw current 4 a / 2.5a / 1.25a 1ch step - down switching regulator b d906xx efj - c general description bd906 xx efj -c is a step - down switching regulator controllers with integrated power mos fet and has the capability to withstand high input voltage, providing a free setting function of operating frequency with external resistor. this switching regulat or controller features a wide input voltage range (3.5 v to 36 v) and operating temperature range ( - 40 c to +125 c). furthermore, an external synchronization input pin enables synchronous operation with external clock. features ? minimal external components ? integrated pch power mos fet ? l ow dropout: 100 % on duty cycle ? e xterna l synchronization enabled ? soft start f unction: 1.38 ms (f = 500 khz) ? current m ode c ontrol ? over current protection ? low supply voltage error prevention ? thermal shut down protection ? s hort c ircuit p rotection ? compact and high power htsop - j8 package mounted ? aec - q100 qualified applications ? automotive battery powered supplies (cluster p anels, car multimedia) ? industrial / consumer supplies key specifications ? input voltage range: 3.5 v to 36 v (initial startup is over 3.9 v) ? output v oltage r ange : 0.8 v to v in ? output switch c urrent : 4 a / 2 .5 a / 1 .25 a ( max ) ? selectable o perating f requency : 50 khz to 6 00 khz ? reference v oltage a ccuracy : 1 % ? shutdown circuit c urrent : 0 a (typ) ? operating t emperature r ange : - 40 c to +125 c package w( typ ) x d( typ ) x h(max) htsop -j8 4.90 mm x 6.00 mm x 1.00 mm htsop -j8 typical application circuit datashee t pvin vin rt en/sync gnd sw fb vc c in cbulk c rt r rt v in v en/sync d1 r3 c1 l1 c o r1 r2 c2 v o
2/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 lineup product name bd90640efj - c bd90620efj - c bd90610efj - c output switch current 4 a 2 .5 a 1 .25 a input m aximum r atings 42 v input r ange (note 1) 3.5 v to 36 v power mos fet on r esistance 0.16 package htsop - j8 power d issipation (note 2) 3.75 w (note 1) initial startup is over 3.9 v (note 2) reduce by 30 mw / c, when mounted on 4 - layer pcb of 70 mm 70 mm 1.6 mm.
3/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 pin configuration pin description pin no. symbol function 1 rt frequency s etting r esistor c onnection 2 sw switching output 3 en / sync enable / synchronizing pulse input 4 gnd gnd 5 vc error amp output 6 vin power supply input (note 1) 7 pvin power system power supply input (note 1) 8 fb output vol tage feedback (note 1) vin and pvin are s horted . block diagram 1. rt 2. sw 3. en / sync 4. gnd 8. fb 7. pvin 6. vin 5. vc pwm_latch drv q s r + - - + + scp_ latch 8 fb 0.8v soft start pch power mos fet slope osc 5 vc 2 sw 1 rt 3 en/sync vref vreg uvlo tsd 6 en uvlo tsd ocp scp_latch off + - 0.55v ocp current sense cur _comp error_amp 4 gnd ocp 7 pvin scp uvlo ocp tsd en/sync scp_latch vin
4/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 description of blocks ? err or - amp the err or - amp block is an error amplifier and its inputs are the reference voltage 0.8 v (typ) and the fb pin voltage. (refer to recommended examples on p.1 6 to 1 7 ) the output vc pin controls the switching duty and output voltage v o . these fb and vc pins are externally mounted for phase compensation. inserting a capacitor and resistor between these pins enables adjustment of phase margin. ? s oft s tart t he function of the soft start block is to prevent the overshoot of the output voltage v o through g radually increasing the input of the error amplifier when the power supply turns on , which also results to the gradual increase of the switching duty . the soft start time is set to 1.38 ms (f = 500 khz). the soft start time is changed by setting of the os cillating frequency. (refer to p.1 7 ) ? en / sync the ic is in normal operation when the voltage on the en / sync terminal is more than 2.6v. the ic is shut down when the voltage on the en / sync terminal is less than 0.8v. furthermore, external synchro nization is possible when pulses are applied to the en / sync terminal. the frequency range of the external synchronization is within 20 % of the oscillation frequency and is limited by the external resistance connected to the rt pin . ex) when r rt is 2 7 k (f = 500 khz), the frequency range of the external synchronization is 400 khz to 600 khz. ? osc (oscillator) this circuit generates the input pulse wave of the slope block. the frequency of the pulse wave can be configured by connecting a resistor to the rt pin. the range of the oscillating frequency is from 50 khz to 600 khz. (refer to p.1 6 figure 13) . the output of the osc block send clock signals to pwm_latch. the generated pulses of the osc block are also used as clock of the counter of ss and scp_latch blocks. ? slope this block generates saw tooth waves using the clock generated by the osc block . the generated saw tooth waves are sent to the cur_comp block and to current se ns e. ? cur_comp the cur_comp block compares the signals between the vc pin and the combined signals from the slope block and current sen s e. the output signals are sent to the pwm_la tc h block . ? pwm_la tc h th e pwm_latch block is a la tc h circuit. the osc block output (set) and cur_comp block output (reset) are the inputs of this block . the pwm_latch block outputs pwm signal s . ? tsd (thermal shutdown ) the tsd block prevent s thermal destruction / thermal ru nway of the ic by turn ing off the output when the temperature of the chip reaches approximately 150 c or more. when the chip temperature falls to a specified level, the output will be reset. however, since the ts d is designed to protect the ic, the chip t emperature should be provided with the thermal shutdown detection temperature of less than approximately 150 c . ? ocp (over current protection) ocp is activated when the voltage between the drain and source (on - resistance load current) of the p - ch power mosfet when it is on, exceeds the reference voltage which is internally set with in the ic . this ocp is a self - return type. when ocp is activated, the duty will be small, and the output voltage will decrease. however, this protection circuit is only effect ive in preventing destruction from sudden accident. it does not support the continuous operation of th e protection circuit (e.g. if a load, which significantly exceeds the output current capacitance, is connected). ? scp (short c ircuit protection) and scp - latch while ocp is operating , and if the output voltage falls below 70 % , scp will be activated . when scp is active , the output will be turned off after a period of 1024 pulse. it extends the time that the output is off to reduce the a verage output current. i n addition, during start - up of the ic, this feature is masked until it reaches a certain output voltage to prevent the wrong triggering of scp. ? uvlo (under voltage lock - out) uvlo is a protection circuit that prevents low voltage m alfunction. it prevent s malfunction of the internal circuit from sudden ris e and fall of power supply voltage . it monitors the v in power supply voltage and the internal regulator voltage. if v in is less than the threshold voltage 3.24 v (typ) , the pch powe r mos fet output is off and the soft - start circuit will be restarted. this threshold voltage has a hysteresis of 280 mv (typ). ? drv (driver) this circuit drives the gate electrode of the pch power mos fet output . it reduces the increase of the pch power mos fets on- resistance by switching the driving voltage when the power supply voltage drop.
5/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 absolute maximum ratings ( ta = 25 c) parameter symbol limits unit power s upply voltage v in pv in 42 v sw pin voltage v sw v in v en / sync pin voltage v en / sync v in v rt , vc, fb pin voltage v rt , v vc , v fb 7 v power dissipation (note 1 ) pd efj 3.75 w storage temperature range tstg - 55 to +150 c maximum junction temperature tjmax 150 c (note 1 ) reduce by 30 mw / c, when mounted on 4 - layerpcb of 70mm 70mm 1.6mm caution : operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol limits unit min max operati ng power supply volta ge (note 1) v in, pv in 3.5 36 v operating temperature range topr - 40 +125 c output switch current (note2) bd90640efj - c i swopr40 - 4 a bd90620efj - c i swopr20 - 2.5 a bd90610efj - c i swopr10 - 1.25 a output voltage v o 0.8 v in v min p ulse w idth t onmin 250 - ns oscillation frequency f sw 50 600 khz oscillation frequency set resistance r rt 22 330 k s ynchron ous o peration f requency range f sync 50 600 khz s ynchron ous o peration f requency f sync - rt - 20 +20 % external clock p ulse d uty d sync 10 90 % (note 1) initial startup is over 3.9 v. (note 2) th e limits include output dc current and output ripple current.
6/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 electrical characteristics ( unless otherwise specified, ta = - 40 c to +125 c, v in = 13.2 v, v en / sync = 5 v ) parameter symbol guaranteed limit unit conditions min t yp m ax 1chip shutdown circuit current i sdn - 0 5 a v en / sync = 0 v, ta < 105 c circuit current i in - 2.2 3.3 ma io = 0 a, v fb = 2 v sw block power mos fet on resistance r on - 0.16 0.32 i sw = 30 ma operating output switch current of overcurrent protection bd90640efj - c i sw limit40 4.0 6.4 - a bd90620efj - c i sw limit20 2.5 4.3 - a bd90610efj - c i sw limit10 1.25 2.2 0 - a output leak current i olk - 0 5 a v in = 36 v, v en/sync = 0 v, ta < 105 c error amp block reference voltage 1 v ref1 0.792 0.800 0.808 v v vc = v fb , ta = 25 c reference voltage 2 v ref2 0.784 0.800 0.816 v v vc = v fb reference voltage input regulation v ref - 0.5 - % 3.5 v v in 36 v input bias current i b - 1.0 - 1.0 a vc s ink c urrent i vcsink - 76.5 - 54.0 - 31.5 a v vc = 1.25 v, v fb = 1.3 v vc s ource c urrent i vc source 31.5 54.0 76.5 a v vc = 1.25 v, v fb = 0.3 v trans conductance g ea 135 270 540 a / v i vc = 10 a , v v c = 1.25 v soft start time t ss 1.13 1.38 1.63 ms r rt = 27 k current s ense p art trans conductance g cs - 5.2 - a / v oscillator block oscillating frequency f sw 450 500 550 khz r rt = 27 k frequency input regulation f sw - 1 - % 3.5 v v in 36 v enable / sync input block threshold voltage v en / sync 0.8 1.9 2.6 v s ync c urrent i en / sync - 23 50 a v en/sync = 5 v uvlo uvlo on mode voltage v uvlo_o n - 3.24 3.50 v uvlo off mode voltage v uvlo_o ff - 3.52 3.90 v uvlo h ysteresis v uvlo_ hys - 280 - mv
7/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 typical performance curves 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 switch current limit : i sw [a] input voltage : v in [v] figure 1. shutdown circuit current vs input voltage figure 2. circuit current vs input voltage figure 3. power mosfet on resistance vs ambient temperature figure 4. switch current limit vs input voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 25 30 35 40 shutdown circuit current : i sdn [a] input voltage : v in [v] from top ta = 125 c ta = 25 c ta = - 40 c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 25 30 35 40 circuit current :i in [ma] input voltage : v in [v] from top ta = 125 c ta = 25 c ta = - 40 c 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -40 -20 0 20 40 60 80 100 120 power mosfet on resistance : r on [] ambient temperature : ta [ ?c ] from top v in = 3.5 v v in = 13.2 v from top bd90640efj - c bd90620efj - c bd90610efj - c ta = 25 c
8/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 figure 5. leak current vs ambient temperature figure 6. reference voltage vs ambient temperature f i gure 7. input bias current vs ambient temperature figure 8. ss time vs ambient temperature 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 leak current : i olk [a] ambient temperature : ta [ ?c ] 784 788 792 796 800 804 808 812 816 -40 -20 0 20 40 60 80 100 120 reference voltage : v ref [mv] ambient temperature : ta [ ?c ] v in = 13.2 v v in = 13.2 v 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 input bias current :i b [a] ambient temperature : ta [ ?c ] v in = 13.2 v v fb = 0.8 v 1.13 1.18 1.23 1.28 1.33 1.38 1.43 1.48 1.53 1.58 1.63 -40 -20 0 20 40 60 80 100 120 soft start time : t ss [s] ambient temperature : ta[ ?c ] r rt =27k
9/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 450 460 470 480 490 500 510 520 530 540 550 -40 -20 0 20 40 60 80 100 120 oscillation frequency : f sw [khz] ambient temperature : ta[ ?c ] figure 10. en / sync threshold voltage vs ambient temperature figure 9. oscillation frequency vs ambient temperature 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 -40 -20 0 20 40 60 80 100 120 en / sync threshold voltage : v en/sync [v] ambient temperature : ta [ ?c ] v in =13.2v r rt =27k figure 12. efficiency vs output current 0 50 100 150 200 250 300 350 400 450 0 5 10 15 20 25 30 35 40 en / sync current : i en / sync [a] en / sync voltage : v en / sync [v] from top ta = 125 c ta = 25 c ta = - 40 c figure 11. en / sync current vs en / sync voltage from top v o = 5 v v o = 3.3 v v in = 13.2 v f sw = 500 khz ta = 25 c refer to external components on p.18 to 19 BD90610EFJ-C io<3.34a bd90620efj-c io<1.84a bd90610efj - c io<0.59a
10/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 timing chart ? basic operation ? over current protection operation vin en / sync ss sw v o vc internal slope sw vo v c internal soft start i l t off * output voltage short to gnd auto reset (soft start operation) fb t ss * t off t ss terminal output voltage short release normal pulse repetition at the following over current detect level short current detect level t off * t off * t off = 1024 / f sw [s] ex)f sw = 500[khz]t off = 2.048[ms] t ss = 1.38 [ms] (typ)
11 / 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 external synchronizing function in order to activate the external synchronizing function, connect the frequency - setting resistor to the rt pin and then input a synchronizing signal to the en / sync pin. for the synchronizing signal, input a pulse wave higher than the oscillation frequency. the external synchronizing operation frequenc y is limited by the external resistance of r rt pin. the allowable setting limit is within 20 % of the oscillation frequency. (e.g. when r rt 27 k ) the external synchronous operation frequency limit is 400 khz to 600 khz because the oscillation frequency is 500 khz. furthermore, the pulse wave s low voltage should be under 0.8 v and the high voltage over 2 . 6 v (when the high voltage is over 11 v the en / sync input current increase s ) , and the slew rate (rise and fall ) under 20 v / s. the duty of external sync pulse should be configured between 10 % and 90%. the frequency will synchronize with the external synchronizing operation frequency after three external sync pulses is sensed. eternal sync sample circuit pvin vin rt en/sync gnd sw fb vc c in cbulk c rt r rt v in d1 r3 c1 l1 c o r1 r2 c2 v o
12/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 continuous action discontinuous action selection of components externally connected necessary parameters in designing the power supply are as follows: parameter symbol specification case input voltage v in 6 v to 36 v o utput voltage v o 5 v output r ipple voltage v pp 2 0 mv p - p input range i o m in 1.0 a / t yp 1.5 a / max 2.0 a switching frequency f sw 5 0 0 khz operating t emperature r ange topr - 40 c to + 1 0 5 c application sample circuit (1) setting the output l constant when the switching regulator supplies electric current continuously to the load, the lc filter is ne cessary for the smoothness of the output voltage. the i l that flows to the inductor becomes small when an inductor with a large inductance value is selected. consequently, the voltage of the output ripple also becomes small. it is the trade - off between the size and the cost of the inductor . the inductance value of the inductor is shown in the next expression: l = (? ?? (???) ? ?? ) ?? ? ?? (???) ? ?? ?? ? [h] where: ? ?? (???) is the m aximum in put voltage ?? ? is the inductor ripple current i l is set to approximately 30 % of i o . if avoid discontinuous operation, i l is set to make sw continuously pulsing (i l keeps continuously flowing) usually. the condition of the continuous operation is shown in the next expression: ? ? > (? ?? (???) ?? ? )? ? 2? ?? (???) ? ?? ? [a] where: ? ? is the load curre nt pvin vin rt en/sync gnd sw fb vc c in cbulk c rt r rt v in v en/sync d1 r3 c1 l1 c o r1 r2 c2 v o sw v t i l t io i l sw v t t io a i l a
13/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 a i o i l t i swlimit (min) i l peak the smaller the i l , the inductor core loss ( iron loss) and l oss due to esr of the output capacitor , the smaller v pp will be. v pp is shown in the next expression . ?? ?? = ?? ? ??? + ?? ? 8? ? ? ?? [v] (a) where: ??? is the e quivalent series resistance of output capacitor ? ? is the o utput condenser capacity the maximum output electric current is limited to the overcurrent protection working current as shown in the next expression . ? ?(???) = ? ???????(???) ? ?? ? 2 [a] where: i o (max) is the m aximum output current i sw limit (min) is the ocp operation current (min) in current mode control, when the ic is operating in duty 50 % and in the condition of continuous operation, it is possible that sub - harmonic oscillation may occur . t he slope compensation circuit is integrated into the ic in order to p revent sub - harmonic oscillation. sub - harmonic oscillation depend s on the rate of increase of output switch current ic. if the induct or value is small, the possibility of sub - h armonic oscillation is increase d . and if the induct or value is large, it is possible that the ic will not operate in. the induct or value which prevents sub - harmonic oscillation is shown in the next expression. l 2d ?1 2(1??) ?? ? ?? (???) ?? ? ? [h] d = ? ? ? ?? (???) ? = 6 ? ?? 10 ?6 where: d is the switching pulse duty. rs is the coefficient of current sense >& 4.0 a / a >' m is the inclination of slope compensator current the shielded type (closed magnetic circu it type) is the recommended type of inductor. open magnetic circuit type can be used for low cost applications and if noise issues are not concerned. but in this case, there is magnetic field radiation between the parts and there should be enough spacing between the parts. for ferri te core inductor type, please note that magnetic saturation may occur. it is necessary not to saturate the core in all cases. precautions must be taken into account on the given provisions of the current rating because it differs according to each manufacturer . please confirm the rated current at the maximum ambient temperature of the application to the manufacturer.
14/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 (2) set of output capacitor c o constant the output capacitor is selected on the basis of esr that is required from the expression ( a ). v pp can be reduced by using a capacitor with a small esr. the ceramic capacitor is the best option that meets this requirement. the ceramic capacitor contributes to the size reduction of the set because it has small esr. please confirm frequency charact eristic of esr from the datasheet of the manufacturer, and consider esr value is low in the switching frequency being used. it is necessary to consider the ceramic capacitor because the dc biasing characteristic is remarkable. f or the voltage rating of the ceramic capacitor, twice or more than the maximum output voltage is usually required. by selecting these high voltages rating, it is possible to reduce the influence of dc bias characteristics. moreover, in order to maintain good temperature characteristi cs, the one with the characteristic of x7r and x5r or more is recommended. because the voltage rating of a mass ceramic capacitor is low, the selection becomes difficult in the application with high output voltage. in that case, please select electrolytic capacitor. please consider having a voltage rating of 1.2 times or more of the output voltage when using electrolytic capacitor. electrolytic capacitors have a high voltage rating, large capacity, small amount of dc biasing characteristic, and are generall y cheap. because main failure mode is open , it is effective to use electrolytic capacitor for applications when reliability is required such as in - vehicle. but there are disadvantages such as, esr is relatively high, and decreases capacitance value at low temperatures. in this case, please take note that v pp may increase at low temperature conditions. moreover, consider the lifetime characteristic of this capacitor because there is a possibility for it to dry up . t hese capacitors are rated in ripple current . the rms values of the ripple electric current obtained in the next expression must not exceed the ratings ripple electric current. ? ?? (???) = ?? ? 12 [a] where: i co (rms) is the value of the ripple electric current i n addition, with respect to c o , choose capacitance value less than the value obtained by the following equation. ? ?(???) = ? ?? (???) (? ??????(???) ?? ?????? ( ??? ) ) ? ? [ f ] where: i sw limit (min) is the ocp operation switch current (min) t ss (min) is the soft start time (min) i sw start (max ) is the m aximum o utput c urrent of boot there is a possibility that boot failure happens when the limits from the above - mentioned are exceeded. especially if the capacitance value is extremely large , over - current protection may be activ ated by the inrush current at startup, and the output does not start . please confirm this on the actual circuit . for stable transient response, the loop is dependent on the c o . please select after confirming the setting of the phase compensation circuit. (3) s etting c onstant of capacitor c in / c bulk input the input capacitor is usually required for two types of decoupling: capacitors c in and bulk capacitors c bulk . ceramic capacitors with values 1 f to 10 f are necessary for the decoupling capacitor. ceramic capacitors are effective by being placed as close as possible to the vin pin. voltage rating is recommended to more than 1.2 times the maximum input voltage, or twice the normal input voltage. the bulk capacitor preven ts the decrease in the line voltage and serves a backup power supply to keep the input potential constant. the low esr electrolytic capacitor with large capacity is suitable for the bulk capacitor. it is necessary to select the best capacitance value as pe r set of application. when impedance on the input side is high because of wiring from the power supply to vin is long, etc., and then high capacitance is needed. in actual conditions , i t is necessary to verify that there is no problem when ic operation tur ns off the output due to the decrease in v in at transient response. in that case, please consider not to exceed the rated ripple current of the capacitor. the rms value of the input ripple electric current is obtained in the next expression. ? ???( ?? ?) = ? ?(???) ? ? ? (? ?? ?? ? ) ? ?? [ a ] where: i cin ( rms ) is the rms value of the input ripple electric current in addition, in automotive and other applications requiring high reliability, it is recommended that capacitors are connected in parallel to accommodate a multiple of electrolytic capacitors to minimize the chances of drying up. it is recommended by making it into two series + two parallel structures to decrease the risk of ceramic capacitor destruction due to short circui t conditio ns. the line has been improved to the summary respectively by 1pack in each capacitor manufacturer and confirms two series and two parallel structures to each manufacturer.
15/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 (4) s etting o utput voltage output voltage is governed by the following equation. ? ? = 0.8 ? 1 +? 2 ? 2 [ v ] please set feedback resistor r2 below 30 k to reduce the error margin by the bias current. in addition, since power efficiency is reduced with a small r1 + r2, please set the current flowing through the feedback resistor to be sm all as possible than the output current i o . (5) selection of the s chottky barrier diode the s chottky barrier diode that has small forward voltage and short reverse recovery time is used for d1. the important parameters for the selection of the schottky barrier diode are the average rectified current and direct current inverse - direction voltage. average rectified current i f ( avg) is obtained in the next expression: ? ?(???) = ? ?(???) ? ?? (???) ?? ? ? ?? (???) [ a ] where: i f ( ave ) is the a verage rectified current the a bsolute maximum rating of the s chottky ba rrier diode rectified current average is more than 1.2 times i f (avg) and the absolute maximum rating of the dc reverse voltage is greater than or equal to 1.2 times t he maximum input voltage. the loss of d1 is obtained in the next expression: ? ?? = ? ?(???) ? ?? ( ??? ) ? ? ? ? ?? (???) ?? [ w ] where: vf is the f orward voltage in i o (max) condition selecting a diode that has small forward voltage, a nd short reverse recovery time is highly effective. please select a diode with 0.6 v max of forward voltage. please note that there is possibility of internal element destruction when a diode with a larger vf than this is used. because the revers e recovery time of the s chottky barrier diode is so short , that it is possible to disregard, the switching loss can be disregarded. when it is necessary for the diode to endure the state of output short - circuit, power dissipation ratings and the heat radia tion ability are needed to be considered. the r ated current that is required is about 1.5 times the overcurrent detection value.
16/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 (6) setting the oscillating frequency the internal oscillating frequency can be set by connecting a resistor to rt. the range t hat can be set is 50 khz to 6 00 khz, and the relation between resistance and the oscillation frequency is decided as shown in the figure below. when setting beyond this range, there is a possibility that there is no oscillation and ic operation cannot be g uaranteed. figure 13. r r t vs f sw r r t vs f sw (7) setting the phase compensation circuit a good high frequency response performance is achieved by setting the 0 db crossing frequency, fc, (frequency at 0 db gain) high. however, you need to be aware of the relationship trade - off between speed and stability. moreover, dc / dc converter application is sampled by switching frequency, so the gain of this switching frequency must be suppresse d. it is necessary to set the 0 db crossing frequency to 1 / 10 or less of the switching frequency. in summary, target these characteristics as follows: ? w hen the gain is 1 (0 db), p hase lag is less than or equal to 135 ?(more than 45 ? phase margin ). ? 0 db crossing frequency is 1 / 10 times or less of the switching frequency. to improve the responsiveness, higher t he phase compensation is set by the capacitor and resistor which are connected in series to the vc pin. achieving stability by using the phase compensation is done by cancelling the fp 1 and fp 2 (error amp pole and power stage pole) of the regulation loop by use of fz 1 . fp 1 , fp 2 and fz 1 are determined in the following equations. ? 5 l 5 6 h?7 h?5 [hz] ? 5 l 5 6 h? h? [hz] ? 6 l ?2 6 h? - ho ? [hz] also, by inserting a capacitor in c2, phase lead fz2 can be added. ? ^6 l 5 6 h?5 h?6 [hz] where: g ea is the error amp trans conductance (270 a / v) a v is the error amp voltage gain (78 db ) r rt [k] f sw [khz] 22 599 24 555 27 500 30 455 33 418 36 386 39 359 43 329 47 303 51 281 56 258 62 235 68 216 75 197 82 182 91 165 r rt [k] f sw [khz] 100 151 110 139 120 128 130 119 150 104 160 98. 180 88 200 80 220 73 240 68 270 61 300 55 330 51
17/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 [s ] setting phase compensation circuit actually, the changes in the frequency characteristic are greatly affected by the type and the condition (temperature, etc.) of parts that are used, the wire routing and layout of the pcb. please confirm stability and responsiveness in actual equipment. to check the actual frequency characteristics, use a fra or a gain - phase analyzer. moreover, the method of observing the degree of change by the loading response can be performed when these measuring instruments are not available. the phase margin degree is said to be low when there are lots of variation quantities after the output is made to change under no load to maximum load. it can also be observed that the phase margin degree is low when there is a lot of ringing f requencies after the transition of no load to maximum load, usually two times or more ringing than the standard. however, a quantitative phase margin degree cannot be confirmed. measurement of frequency characteristic (8) setting of soft start time (t ss ) the soft start function is necessary to prevent inrush of coil current and output voltage overshoot at startup. t ss will be changed by setting the oscillating frequency. the production tolerance of t ss is 18.1%.t ss can be calculated by using the equation. ? ?? = ??? . ? ? ?? inadequate phase margin adequate phase margin. load maximum load output voltage t vo c 2 r 1 r 2 v ref error amp vc r 3 c 1 sw d1 l1 c o r esr r o vo
18/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 application examples parameter symbol specification case product name ic bd90640efj - c input v oltage v in 6 v to 36 v output voltage v o 5 v output ripple voltage v pp 2 0 mvp - p output current i o m in 1.0 a / t yp 1 . 5 a / m ax 2.0 a s witching f requency f sw 5 0 0 khz o perating t emperature topr - 40 c to 1 05 c s pecification e xample 1 referen ce c ircuit 1 parts list 1 no pa c kage parameters part name(series) typ e m a nufacturer r1 1608 43 k , 1 % , 1 / 16 w mcr01 series chip resisters rohm r2 1608 8.2 k , 1 % , 1 / 16 w mcr01 series chip resisters rohm r3 1608 33 k, 1 %, 1 / 16 w mcr01 series chip resisters rohm r 100 - short - - - r rt 1608 27 k, 1 %, 1 / 16 w mcr01 series chip resisters rohm c1 1608 33 00 pf , r , 50 v gcm series ceramic capacitors murata c2 - open - - - c rt 1608 100 pf , ch , 50 v gcm series ceramic capacitors murata c in 3216 4.7 f , x7r , 50 v gcm series ceramic capacitors murata c o 3216 22 f , x7r , 1 0 v 2 gcm series ceramic capacitors murata c bulk - 220 f , 50 v cd series electrolytic capacitors nichicon l 1 w 9.7 x h 4.5 x l 10 mm 3 4 . 7 h clf10040 series c oil tdk d 1 p m d s average i = 3 a max rb0 50l - 4 0 schottky diode s rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=1.5a 2 s/div v in =13.2v io=1.5a v in =1 3.2v io=1.5a 2.0a 200 s/div vo 10mv/div ac i o 50 0m a /div d c v o 5 0m v /div a c conversion efficiency output ripple voltage frequency character load change pvin vin rt en/sync gnd sw fb vc c in cbulk c rt r rt v in v en/sync d1 r3 c1 l1 c o r1 r2 c2 v o r100 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 efficiency : [%] output current : io [a ]
19/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 parameter symbol specification case product name ic bd90640efj - c input v oltage v in 3. 5 v to 20 v output voltage v o 3.3 v output ripple voltage v pp 20 mvp - p output current i o min 1.0 a / t yp 1.5 a / m ax 2.0a s witching f requency f sw 5 00 khz o perating t emperature topr - 40 c to 125 c s pecification e xample 2 referenc e c irc uit 2 parts list 2 no package parameters part name(series) typ e manufacturer r1 1608 4 7 k, 1 %, 1 / 16 w mcr01 series chip resisters rohm r2 1608 15 k, 1 %, 1 / 16 w mcr01 series chip resisters rohm r3 1608 6.8 k, 1 %, 1 / 16 w mcr01 series chip resisters rohm r 100 - short - - - r rt 1608 27 k, 1 %, 1 / 16 w mcr01 series chip resisters rohm c1 1608 33 00 pf, r, 50 v gcm series ceramic capacitors murata c2 - open - - - c rt 1608 100 pf, ch, 50 v gcm series ceramic capacitors murata c in 3216 4.7 f, x7r, 50 v gcm series ceramic capacitors murata c o 3216 22 f, x7r, 10 v 2 gcm series ceramic capacitors murata c bulk - 220 f, 50 v c d series electrolytic capacitors nichicon l 1 w 9.7 x h 4.5 x l 10 mm 3 4.7 h clf10040 series coil tdk d 1 pmds average i = 3 a max rb0 50l - 40 schottky diode s rohm tektronix dpo5054 fra5087 tektronix dpo5054 v in =13.2v io=1.5a 2 s/div v in =13.2v io=1.5a v in = 13.2v io=1.5a 2.0a 200 s/div vo 10mv/div ac i o 50 0m a /div d c v o 5 0m v /div a c conversion efficiency output ripple voltage frequency character istics load change pvin vin rt en/sync gnd sw fb vc c in cbulk c rt r rt v in v en/sync d1 r3 c1 l1 c o r1 r2 c2 v o r100 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 efficiency : [%] output current : io [a ]
20/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 input filter figure 14. filter c ircuit the input filter circuit for emc measures is depicted in the above figure 14. the type filters are the three - element lc filters. when the decoupling capacitor for high frequency is insufficient, it uses type filters. because a large attenuation characteristic is obtained, an excelle nt characteristic can be obtained using an emi filter. tvs (transient voltage suppressors) are used for the first protection of the in - vehicle power supply line. because it is necessary to endure high energy when the load is connected, a general z ener diod e is insufficient. the following are recommended. to protect it when the power supply such as battery is accidentally connected in reverse , reverse polarity protection diode is needed. parts of f ilter c ir cuit recommended p arts manufacturer l ist shown below is the list of the recommended parts manufacturers for reference. device part name(series) m a nufacture r l clf series tdk l xal series coilcraft c cj series nichicon c cz series nichicon tvs sm8 series vishay d s3a thru s3m series vishay device typ e m a nufacture r url c electrolytic capacitors nichicon www.nichicon.com c ceramic capacitors murata www.murata.com l c oils tdk www.global.tdk.com l coils coilcraft www.coilcraft.com l coils sumida www.sumida.com d diodes vishay www.vishay.com d diodes/res isters rohm www.rohm.com bd906xx efj-c c c c c c c c c c c ?o diode l ??? d tvs
21/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 directions f or pattern layout of pcb exposed die pad is need ed to be connected to gnd. application circuit arrange the wirings of the wide lines , shown above, as short as possible in a broad pattern. locate the input ceramic capacitor c in as close to the vin - gnd pin as possible. locate r rt as close to the rt pin as possible. locate r1 and r2 as close to the fb pin as possible, and provide the shortest wiring from the r1 and r2 to the fb pin. locate r1 and r2 as far away from the l1 as possible. separate power gnd (schottky diode, i/o capacitor `s gnd) and s ig nal gnd (r t , vc ), so that sw noise does n o t have an effect on signal gnd at all. the feedback frequency characteristics (phase margin) can be measured using fra by inserting a resistor at the location of r100. however, this should be shorted during normal operation. r100 is option pattern for measuring the feedback frequency characteristics. referen ce l ayout p attern (top view) referenc e l ayout p attern (bottom view) 1.rt 4.gnd 8.fb 5.vc v o l1 c o 1 d1 r rt c rt r3 c1 c in 1 c in 2 c o 2 cbulk r1 r100 r2 2.sw 3.en/sync 7.pvin 6.vin c2 r3 c1 gnd en sw rt vc vin pvin fb gnd vin1 vo pgnd pgnd c rt r rt r2 c2 r1 r100 d1 en/ sync vin1 vo pgnd pgnd en/ sync cbulk c in 2 c in 1 l1 c o 1 c o 2 gnd
22/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 power dissipation for thermal design, be sure to operate the ic within the following conditions. (since the temperatures described hereunder are all guaranteed temperature s , take margin into account.) 1. the ambient temperature ta is to be 125 c or less. 2. the chip junction temperature tj is to be 150 c or less. the chip junction temperature tj can be considered in the following two patterns: to obtain tj from the ic surface temperature tc in actual use ?? = ?? + ??? ? to obtain tj from the ambient temperature ta ?? = ?? + ?? ? ? m a : htsop - j8 249.5 c / w single piece of ic 153.2 c / w 1 - layer pcb 113.6 c / w 2 - layer pcb (copper foil area on the front side of pcb : 15mm x 15mm) 59.2 c / w 2 - layer pcb (copper foil area on the front side of pcb : 70mm x 70mm) 33.3 c / w 4 - layer pcb (copper foil area on the front side of pcb : 70mm x 70mm) pcb size : 70mm x 70mm x 1.6mm (pcb incorporates thermal via) the heat loss w of the ic can be obtained by the formula shown below: w = ? ?? ? ? 2 ? ? ? ?? + ? ?? ? ?? + ?? ? ?? ? ? ??? where: r on is the on r esistance of ic (r efer to page 7 ) [ ] i o is the load current [a] v o is the output voltage [ v] v in is the input voltage [ v] i cc is the circuit current (r efer to page 7 ) [a] tr is the switching rise t ime [s] f sw is the oscillating frequency [hz] ? ?? ? ? 2 2 1 2 ?? ? ?? ? ? 1 ? = ?? ? ?? ? ? ??? s w w ave form sw wave form v in gnd tr (17 ns) t= fsw 1
23/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 thermal reduction characteristics htsop- j8 figure 1 5 . therma l r eduction c haracteristics standalone ic mounted on rohm standard board (1 - layer pcb) mounted on rohm standard board (2 - layer pcb copper foil area on the front side of pcb: 15 mm 15 mm ) mounted on rohm standard board (2 - layer pcb copper foil area on the front side of pcb: 70 mm 70 mm ) mounted on rohm standard board (4 - layer pcb copper foil area on the front side of pcb: 70 mm 70 mm ) pcb size: 70mm70mm1.6mm (pcb incorporates thermal via) 3.75 w 2.11 w 1.10 w 0.82 w 0.50 w
24/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 i/o equivalent circuit vc rt sw fb en / sync vc vin 1k 30k 1k 1k internal supply internal supply sw vin pvin en/sync vin 185k 200k 400k 1333k 100k 250k rt 30k 4m 1k vin internal supply 10k 30k fb vin 30k 200k internal supply internal supply
25/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electro lytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces sho uld be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause vari ations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possibl e that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance , power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off complet ely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
26/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 11. unused input pins input terminals of an ic are often connected to the gate o f a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the c onduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isola tion and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure b elow): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diode s can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal s hutdown c ircuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal o peration should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over c urrent p rotection c ircuit (ocp) this ic has a built - in overcurrent protection circuit that activates when the output is accidentally shorted. however, it is strongly advised n ot to subject the ic to prolonged shorting of the output. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c b e transistor (npn) resistor n region close-by parasitic elements
27/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 ordering information b d 9 0 6 4 0 e f j - c e 2 product name output switch c urrent 90640 : 4 a 90620 : 2 .5 a 90610 : 1 .25 a package efj : htsop - j8 product rank c : for automotive tape and reel information e2: reel type embossed taping marking diagram output switch current part number marking 4 a d90640 2 .5 a d90620 1 .25 a d90610 htsop - j8 (top view) part number marking lot number 1pin mark
28/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 physical dimension , tape and reel information package name htsop - j8
29/ 29 bd906 xx efj - c tsz02201 - 0t1t0al00130 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 07.apr.2014 rev.002 revision history date revision changes 06 . jan .201 4 001 new release 0 7 .apr.2014 002 p. 4 description of ocp remove sentence furthermore ~ p.6 operating output switch current of overcurrent protection symbol change i swlimit . p.18 parts list d1 package change pmds p.19 parts list c2 change open p.21 about directions f or pattern layout of pcb change and s ignal gnd (r t , vc , ),
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

▲Up To Search▲

Price & Availability of BD90610EFJ-C

	To Download BD90610EFJ-C Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .